ACM Research, Inc. (ACM) develops, manufactures and sells single-wafer wet cleaning equipment used in the manufacturing process of integrated chips. The Company markets and sells its single-wafer wet-cleaning equipment, under the brand name Ultra C, based on the Company’s Space Alternated Phase Shift (SAPS) and Timely Energized Bubble Oscillation (TEBO) technologies. These tools are designed to remove random defects from a wafer surface efficiently, without damaging the wafer or its features. The Company’s products are designed for the use in fabricating foundry, logic and memory chips, including dynamic random-access memory (DRAM) and 3D NAND-flash memory chips. AMC also develops, manufactures and sells a range of packaging tools to wafer assembly and packaging customers.
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